Sequans

SQN66430 Monarch SiP

Contact manufacturer
Sales
Address

Sequans Communications, Sales department, 19 le parvis de la Défense, 92073 Paris la Défense, France

Phone

+33170721600

Sequans

SQN66430 Monarch SiP

Key features
  • Supports narrowband LTE UE categories M1/NB1
  • SiP integrates the entire RF front end, transceiver, power management, memory, and baseband modem
  • 3GPP Release 13 LTE Advanced Pro
  • 8.8 mm x 10.8 mm x 0.95mm LGA package, 0.5mm pitch
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Product description

The SQN66430/SKY66430-11 is a multi-band multi-chip System-in-Package (SiP) supporting cellular LTE Cat-M1/Cat-NB1 (half-duplex FDD) platforms. The SiP integrates the entire RF front end, transceiver, power management, memory, and baseband modem. SQN66430/SKY66430-11 complies with the ultra-low-power and reduced complexity feature requirements of the 3GPP release 13 LTE Advanced Pro standard, defining narrowband, low data rate LTE technology for machine-type-communications (MTC). SiP achieves a very high level of integration, running Sequans’ carrier-proven LTE protocol stack, an OMA lightweight M2M (LWM2M) client for over-the-air device management, and a rich set of AT commands. Key features: - Supports narrowband LTE UE categories M1/NB1 - World's smallest and thinnest LTE IoT connectivity solution - Integrated baseband, RF, RAM memory, power management and analog front end - 23dBm/ 20dBm/ 14dBm power classes for lower data plan usage and ultra-efficient power consumption at cell edge and deep indoor with fewer repetitions - 1 uA PSM for long sleep duration use cases - eco-Paging™ for ultra-low eDRX power consumption - IoT-Findit™ location engine for accurate indoor/outdoor location with or without GNSS - Single-SKU™ global deployment and roaming capability

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Overview
Network technology
LTE Only
LTE category support
Cat M1
Hardware & Network
Features
UDP
Checked
TCP
Checked
UART
Checked
GPIO
Checked
Serial
Checked
GPS
LTE

Band13 (700 MHz)

Software
FCC ID

TBC

Other features
Voice capable
Native IM client
Battery safety
SMS Capability
Checked
Developer Kit
Checked
Chassis & power source
Dimensions

8.8 mm x 10.8 mm x 0.95mm

Relative humidity

Rated moisture sensitivity level 3 (MSL3) at 260C

Stored temperature

-40°C to +85°C

Operating temperature

-40°C to +85°C

Weight

Voltage supply

3.1 V to 5.5 V

Power consumption

Rated moisture sensitivity level 3 (MSL3) at 260C

Contact
Website

http://www.sequans.com/

Sales
Address

Sequans Communications, Sales department, 19 le parvis de la Défense, 92073 Paris la Défense, France

Phone

+33170721600

Email

sequans-sales@sequans.com

Technical support
Address

Sequans Communications, Sales department, 19 le parvis de la Défense, 92073 Paris la Défense, France

Phone

+33170721600

Email

sequans-sales@sequans.com